Spin Dryer

Spin Dryer

We are a manufacturer mainly focusing on wafer cleaning device / etching device /
spin dryer etc. / and semiconductor manufacturing device.
We also develop and manufacture cleaning device for LCD, PDP, organic EL, FED, LED and more with our technology.
We are able to offer at a low price since all products are manufactured within the company.
Please feel free to contact us regarding maintenance for our's and also other companies' products.

  • Spin Dryer

    The spin dryer dries substrates wafers and other substrates.
    2 cassettes or 4 cassettes with wafers of 300 mm or less are manually loaded vertically and spin-dried.

    Spin Dryer

    Specification

    Model SPD400・500・600・800・1200
    4 Carrier Type (2 carrier type is also available)
    However, 8 inch and 12 inch are 2 carrier type
    Rotation Speed Draining 0~1200 rpm (variable)
    Normally 400~600 rpm (variable)
    Drying 0~1200 rpm (variable)
    Normally 700~1000 rpm (variable)
    Processing Time Draining 0~999.9sec (variable)
    Drying 0~999.9sec (variable)
    ULPA Filter 0.1um, repair rate above 99.9995%
    Lid Automatic opening and shutting by air cylinder
    Exhaust Automatic damper is equipped, 1 at the back of device
    Shaft Sealant Special seal
    Power Supply 3φ AC200V 6KVA 50 / 60Hz
  • Desktop Type Spin Dryer

    Two cassettes or four cassettes with substrates of 150mm or less are loaded vertically and spin-dried.

    Desktop Type Spin Dryer

    Features

    • HEPA or ULPA filter is built in the lid, and clean air is taken in to maintain the cleanliness of the chamber.
    • Easy to move because of a desktop type.
    • Both the body and the chamber are made of PVC and unrustable.

    Specification

    Model SPD400・500・600・800・1200
    4 Carrier Type (2 carrier type is also possible)
    However, 8 inch and 12 inch are 2 carrier type
    Rotation Speed Draining 0-1200 rpm (variable)
    Normal 400-600 rpm (variable)
    Drying 0-1200 rpm (variable)
    Normal700-1000 rpm (variable)
    Processing Time Draining 0-999.9sec (variable)
    Drying 0-999.9sec (variable)
    ULPA Filter 0.1um, repair rate over 99.9995%
    Lid Automatic opening and closing by air cylinder
    Exhaust Comes with auto damper, one place in the back
    Shaft Sealant Special sealant
    Power Supply 3φAC200V 6KVA 50/60Hz
  • Desktop Type Spin Dryer (SF Type)

    Desktop Type Spin Dryer (SF Type)

    Features

    • Widely used compact desktop type that dries a small amount of silicon or compound semiconductor wafers.
    • The operation is very easy, just set the wafer on the turntable, close the top lid, then, press the start button for safe spin drying.

    Specification

    Model SF-300 type spinner SF-600 type spinner
    Wafer Size 3 inches~5 inches 4 inches~8 inches (6 sheets processed by 6 inch)
    Turntable Diameter 300m/m made of PVC Diameter 600m/m made of PVC
    Rotation Speed Drying rotation 0 to 2000 rpm (variable) Drying rotation 0 to 1800 rpm (variable)
    Drying N2 blow (vary from 0~2000 rpm) N2 blow (vary from 0~2000 rpm)
    Outer Dimension 450Wx500Dx450H Made of PVC 650Wx650Dx500H Made of PVC
    Power Supply AC 100V 4A AC 100V 6A