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Load-lock Type EB Vapor Deposition System
Features
- Our original heating mechanism of rapid temperature-raising/lowering for a substrate temperature 900℃.
- Superior film thickness uniformity and reproducibility
- High vacuum process is possible by load lock type
- Particle reduction with optimal surface treatment
- Easy chamber maintenance
- Low temperature process such as liftoff ,etc. is also available
Applications
- LED
- Electronic components
- Optical components
- MEMS
- Power device
Specification
Substrate Size φ12 inch maximum Substrate Heating Temperature 700 ° C (substrate surface) Evaporation Material Metal or oxide Vacuum Exhaust CP+DP Film Thickness Control Crystal type Control Operation Control: PLC
Operation: Touch panel or PCData Logging External memory or PC Substrate Transfer Vacuum transfer robot Option Substrate heating 900 ° C (substrate surface)
Substrate cooling
Substrate bias
Substrate rotation
Reactive gas supply unit and more -
Vapor Deposition System For OLED
Overview
Multi chamber type for device and material development.
The system processes pretreatment, film deposition and film sealing without making it contact with atmosphere.
Plasma cleaning chamber, organic vapor deposition chamber, electrode vapor deposition chamber, sealing chamber and others can be selected according to your purpose.Features
- Available up to 300mm square substrate.
- Deposition cells can be selected from various materials and sizes
- CVD chamber, sputtering chamber and others can be selected.
Applications
- OLED Display
- OLED Lighting
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EB Vapor deposition Ion Beam Sputtering Composite System
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Lubrication Deposition System for Research and Development
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High Vacuum Ultra High Temperature EB Deposition System
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Ag Evaporation Source For OLED
