▼Customization Examples
■Electrode and Magnet Design
① Sputtering Electrode Design for 3D Objects
② Sputtering Electrode Design for Powder Coating
■Special Work Stage Specifications
① Heating Temperature: Room Temperature to 1000°C
② Rotation, Revolution, Tilt Mechanism, and Bias Mechanism
③ PZT Single Crystal Thin Film Sputtering System Design
■Multi-Chamber System for Different Film Deposition Methods
① Multi-Chamber System Equipped with a Sputtering Chamber and a CVD Chamber
② Multi-Chamber System Combining Different Film Deposition Processes, Including Sputtering, CVD, and Vapor Deposition

• Annealing System for Research and Development

  

• Low Temperature Glow Plasma Experimental System

  

• Cryogenic Film Deposition System

  

• R to R Plasma Processing System for 390 mm Wide Film

  

• TMP+RP Exhaust Set

  

• Batch Type Plasma Processing System

  

• Ultra High Vacuum Chamber for Analysis

  

• HW System Surface Modifier (CAT)

  

• Load Lock Type Plasma CVD System (our demo machine)