• Hi pressure RTA System

    Hi pressure RTA System

    Features

    • Applicable from vacuum process to Hi pressure process (0.9MPaG)
    • Applicable for high-speed thermal oxidation, crystallisation, annealing process and more to the substrate surface.
    • Superior substrate temperature uniformity and gas flow method
    • Applicable for tray transportation

    Applications

    • Semiconductor
    • MEMS
    • Electronic components

    Specification

    Wafer Size Up to φ12 inch
    Process Gas O2, N2, H2O (optional)
    Substrate Heating Temperature Up to 1000 ° C (substrate surface)
    Heat Source Halogen Lamp
    Heating Rate Up to 150 ° C/sec
    Vacuum Exhaust DP
    Control Operation Control: PLC
    Operation: Touch panel or PC
    Data Logging External memory or PC
    Substrate Transfer Atmospheric transport robot

  • Vacuum Drying Oven System

    Vacuum Drying Oven System

    Features

    • Operating temperature range: Maximum 450 ° C
    • Ultimate pressure: 10Pa
    • Process recipe : 30
    • Drying shelf: 2 stages

    Applications

    • Vacuum drying of sputter target
    • Vacuum drying of vacuum components
    • Vacuum drying of jigs and more

    Specification

    Effective Dimensions 600W x 500D x 200H
    Drying shelf 2 stages
    Heating Temperature Up to 450 ℃
    Vacuum Exhaust Gas DP
    Chamber Cooling Water cooling
    Control Operation Control: PLC
    Operation: Touch panel or PC
    Data Logging External Memory or PC