• Load-lock Type Sputtering System

    Load-lock Type Sputtering System

    Features

    • Our original sputtering cathode
    • Moving magnets for full erosion
    • Our original heating mechanism of rapid temperature-raising/lowering for a substrate temperature 900℃.
    • High-speed and stable reactive sputtering film deposition is possible by plasma emission analysis and feedback control.
    • Low temperature process such as liftoff ,etc. is also available　
    • Applicable for tray transportation
    • Combinations such as CVD room, vapor deposition room, plasma cleaning room, etc. are also available.

    Applications

    • Semiconductor
    • MEMS
    • Electronic components
    • Optical components
    • Vehicle components

    Specification

    Sputtring Cathode φ12 inch maximum
    Sputtring Power Supply Magnetron Method
    Target shutter
    Spatter Power Supply RF or DC
    Process Gas Ar, O2, N2, etc.
    Substrate Stage Substrate heating: 700 ° C (substrate surface)
    Rotation: 20rpm maximum
    Vacuum Exhaust Type 1：TMP+DP
    Type 2：CP+DP
    Pressure Control APC
    Control Operation Control: PLC
    Operation: Touch panel or PC
    Data Logging External memory or PC
    Substrate Transfer Vacuum transfer robot
    Option Substrate bias(RF or DC)
    Substrate cooling (low temperature film deposition)
    Moving magnet
    Cathode for magnetic material target
    Plasma emission monitor
    Tray transportation
    Q-MASS and more

  • Multiple Sputtering System

    Multiple Sputtering System

    Features

    • Our original sputtering cathode
    • 3-Axis mechanism (elevation, revolution and rotation) is equipped on the substrate stage for film thickness uniformity
    • Our original heating mechanism of rapid temperature-raising/lowering for a substrate temperature 900℃.
    • Up to 4 sputtering cathodes can be equipped for a multilayer film of metallic films, oxide films and more.
    • Combinations such as CVD room, vapor deposition room, plasma cleaning room, etc. are also available.

    Applications

    • Semiconductor
    • MEMS
    • Electronic components
    • Optical components
    • Vehicle components

    Specification

    Sputtring Cathode φ12 inch maximum
    Sputtring Power Supply Magnetron method
    Target shutter
    Spatter Power Supply RF or DC
    Process Gas Ar, O2, N2, etc.
    Substrate Stage Substrate heating: 700 ° C (substrate surface)
    Rotation: 30 rpm
    Revolution: 10 rpm
    Elevation: 50mmst
    Vacuum Exhaust Type 1：TMP+DP
    Type 2：CP+DP
    Pressure Control APC
    Control Operation Control: PLC
    Operation: Touch panel or PC
    Data Logging External memory or PC
    Substrate Transfer Vacuum transfer robot
    Option Substrate bias(RF or DC)
    Substrate cooling (low temperature film
    Moving magnet
    Cathode for magnetic material target
    Plasma emission monitor
    Tray transportation

  • Batch Type 3D Sputtering System

    Batch Type 3D Sputtering System

    Features

    • Our original sputtering cathode
    • Deposition stage is equipped with a 4-axis mechanism (elevation, revolution, rotation, tilt).
      Achieves high coverage for three-dimensional objects.
    • Up to 3 sputtering cathodes can be equipped for a multilayer film of metallic films, oxide films and more.

    Applications

    • MEMS
    • Electronic components
    • Optical components
    • Vehicle components

    Specification

    Substrate Size φ5 inchx40mm high maximum
    Please contact us as it depends on the shape, size, material and more.
    Sputtring Cathode Magnetron method
    Target shutter
    Sputtring Power Supply RF or DC
    Process Gas Ar, O2, N2, etc.
    Work Stage Heating temperature: 500 ° C (substate surface)
    Rotation: 30 rpm
    Revolution: 10 rpm
    Elevation: 40mmst
    Tilt: ±30°
    Substrate bias (RF or DC)
    Vacuum Exhaust TMP + RP
    Pressure Control APC
    Control Operation Control: PLC
    Operation: Touch panel or PC
    Data Logging External memory or PC
    Work mounting Top lid that elevates, turns, opens and shuts
    Option Substrate cooling (low temperature film deposition)
    Moving magnet
    Cathode for magnetic material target
    Dry pump
    Plasma emission monitor
    Q-MASS and more

  • Ultra High Temperature Sputtering System for Thin Film MEMS

    Ultra High Temperature Sputtering System for Thin Film MEMS

  • Batch Type Sputtering System for Thin Film MEMS

    Batch Type Sputtering System for Thin Film MEMS

  • IBS System for Research and Development

    IBS System for Research and Development

  • Multiple Sputtering RTA Composite System
    * Operating at a coin laundry in Tohoku University

    Multiple Sputtering RTA Composite System * Operating at a coin laundry in Tohoku University

  • Sputtering System with GB For OLED

    Sputtering System with GB For OLED

  • Load-lock Type Dual Cathode Sputtering System

    Load-lock Type Dual Cathode Sputtering System

  • Batch Type Triple Cathode Sputtering System for Research and Development

    Batch Type Triple Cathode Sputtering System for Research and Development