Water Etcher
Etching Device
We are a manufacturer mainly focusing on wafer cleaning device / etching device /
spin dryer etc. / and semiconductor manufacturing device.
We are a company that can manufacture according to your desires, whether small device for research, or automatic device for mass production purposes.
We also develop and manufacture cleaning device for LCD, PDP, organic EL, FED, LED and more with our technology.
We are able to offer at a low price since all products are manufactured within the company.
Please feel free to contact us regarding maintenance for our's and also other companies' products.
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Single Wafer Etching System
Single wafer etching system processes cleaning, etching, rinsing and drying automatically.
Specification
Wafer Size ～φ300m/m HEPA or ULPA Optional Rotation Speed Etching ~500rpm
Drying ~3000rpmChemical 2 fluid/ heating and more
Paddle typeRinsing Antistatic/ back rinse and more
Paddle typeIN/OUT Cassette to cassette Drying NS blow / ioniser -
Automatic Etching System
The single wafer etching system sprays a temperature-controlled etchant chemical evenly to achieve a highly uniform etching process.
Specification
Wafer Size ～φ300m/m HEPA or ULPA Optional Function Etching liquid temperature control/ spray/ paddle/ soaking
Drying ~3000rpmOthers Densitometer/ acid/ alkaline/ multi chamber Rotation Speed Standard 3000rpm maximum IN/OUT Cassette to cassette/ Foup and more Conveyor Articulated robot
Holding method = edge clamp/ electrostatic/ Bernoulli and more -
Wafer Acid Etching System
The acid etching system etches wafers set in a special barrel by batch processing.
Specification
Wafer Size ～φ300m/m HEPA or ULPA Optional Conveyance Servo motor/ Convey within a second Chemical Mixed acid/ alkaline system Others QDR/ transfer mechanism/ fully automatic IN/OUT Barrel to barrel Chemical Managing Densitometer/ temperature control -
Simplified Wafer Etching System
This system is a semi-automatic that processes etching of wafers by manually setting a basket containing a wafer cassette to the hanger of the system, and the basket is transferred through a circular arcuate transfer from the etching processing bath to a rinsing bath.
Specification
Wafer Size ～φ200m/m HEPA or ULPA Optional Rotation Speed Etching ~500rpm
Drying ~3000rpmChemical Circulation & filter/ overheat cooling/ rotation mechanism/ bubbling Rinsing QDR/ OF/ bubbling LD / ULD Stage available Driving Servo motor/ arc conveyance
