Water Etcher

Etching Device

ウエハー洗浄機、エッチング装置、スピンドライヤー等、半導体製造装置を主としたメーカーです。
お客様のニーズに合わせて、研究用の小型機から量産用の自動装置を小回りのきく企業として製造いたします。
また、これらの技術を生かしLCD.PDP.有機EL.FED.LED等の洗浄装置も開発製造いたしております。
全ての商品を自社にて製造いたしておりますので、安価にて御提供することが出来ます。
他社製品でのメンテナンスでお困りの場合でも対応できますので、お気軽にお声がけください。

  • Spray Type Wafer Etching Device

    Wafer transfers by each, and it is treated spray etching in acidsimultaneouslyand rinsed with DI water.

    Spray Type Wafer Etching Device

    Specification

    Wafer Size ~φ300m/m
    HEPA or ULPA Optional
    Rotation Speed Etching ~500rpm
    Drying ~3000rpm
    Chemical 2 fluid/ heating and more
    Paddle type
    Rinsing Antistatic/ back rinse and more
    Paddle type
    IN/OUT Cassette to cassette
    Drying NS blow / ioniser
  • Automatic Etching Device

    A single-wafer etching device sprays the etching solution kept at a constant temperature evenly to achieve high-precision etching processing.

    Automatic Etching Device

    Specification

    Wafer Size ~φ300m/m
    HEPA or ULPA Optional
    Function Etching liquid temperature control/ spray/ paddle/ soaking
    Drying ~3000rpm
    Others Densitometer/ acid/ alkaline/ multi chamber
    Rotation Speed Standard 3000rpm maximum
    IN/OUT Cassette to cassette/ Foup and more
    Conveyor Articulated robot
    Holding method = edge clamp/ electrostatic/ Bernoulli and more
  • Rapid Wafer Etching Device

    Wafers transferred to a special barrel are batch etched.

    Rapid Wafer Etching Device

    Specification

    Wafer Size ~φ300m/m
    HEPA or ULPA Optional
    Conveyance Servo motor/ Convey within a second
    Chemical Mixed acid/ alkaline system
    Others QDR/ transfer mechanism/ fully automatic
    IN/OUT Barrel to barrel
    Chemical Managing Densitometer/ temperature control
  • Simple Wafer Etching Device

    This machine is a semi-automatic device that manually attaches a basket containing a cassette to a hanger,
    transports it in an arc from the processing tank to the rinsing tank, and processes the wafer.

    Simple Wafer Etching Device

    Specification

    Wafer Size ~φ200m/m
    HEPA or ULPA Optional
    Rotation Speed Etching ~500rpm
    Drying ~3000rpm
    Chemical Circulation & filter/ overheat cooling/ rotation mechanism/ bubbling
    Rinsing QDR/ OF/ bubbling
    LD / ULD Stage available
    Driving Servo motor/ arc conveyance