Water Automatic Cleaner

Wafer Automatic Cleaning Device

We are a manufacturer mainly focusing on wafer cleaning device / etching device /
spin dryer etc. / and semiconductor manufacturing device.
We are a company that can manufacture according to your desires, whether small device for research,
or automatic device for mass production purposes.
We also develop and manufacture cleaning device for LCD, PDP, organic EL, FED, LED and more with our technology.
We are able to offer at a low price since all products are manufactured within the company.
Please feel free to contact us regarding maintenance for our's and also other companies' products.

  • Cassetteless Automatic Cleaning System

    The cassetteless automatic cleaning system grips only the wafers and cleans them without a cassette. Available up to Φ300 wafer size.

    Cassetteless Automatic Cleaning System

    Specification

    Wafer Size ～φ300m/m
    HEPA or ULPA Built-in filter
    Robot Servo motor
    Chemical Tank Shaking, ultrasonic cleaning, megasonic cleaning
    Rinse Tank Bubbling, QDR, resistivity meter installed
    ULD lonaizar (optional)
    Drying S/ D. IPA V/ D. Pull out
  • 300mm Wafer Automatic Cleaning System

    300mm Wafer Automatic Cleaning System

    The 300mm wafer automatic cleaning device is a cassette type batch type cleaning device.
    We can handle up to Φ300.

    Specification

    Wafer Size ～φ300m/m
    HEPA or ULPA Built-in filter
    Robot Servo motor
    Chemical Tank Shaking, ultrasonic cleaning, megasonic cleaning
    Rinse Tank Bubbling, QDR, resistivity meter installed
    ULD lonaizar (optional)
    Drying S/D

    Process Example

    • LD
    • OF
    • APM
    • APM
    • QDR
    • HPM
    • QDR
    • 03
      OF
    • S/D
    • ULD

  • Single Wafer Automatic Cleaning System

    The single wafer automatic cleaning system is free from cross contamination.
    We propose the optimum cleaning method for various processes. (FOUP available)

    Single Wafer Automatic Cleaning System

    Specification

    Wafer Size ～φ300m/m
    HEPA or ULPA Organic, alkaline, acid
    Pure Water Rinse O3+pure water, CO2+pure water
    Transport Mechanism Clean robot
    Ultrasound Megasonic
    Drying Spin, N2 blow, hot plate
    Optional Brush cleaning, high pressure jet